Practical RF Hardware and PCB Design Tips - Phil's Lab #19
Some tips for when designing hardware and PCBs with simple RF sections and components. These concepts have aided me well when designing 4-layer embedded systems PCBs.
Topics: critical trace lengths, stackups, controlled impedance traces (microstrip, stripline), impedance discontinuities due to wide pads, clearances, bias tees.
Topics: critical trace lengths, stackups, controlled impedance traces (microstrip, stripline), impedance discontinuities due to wide pads, clearances, bias tees.
Chapters:
- 00:00Introduction
- 00:53Overview
- 02:08Critical length
- 06:45Stackup
- 08:51Controlled impedance traces
- 12:34Impedance discontinuities (pad-to-trace)
- 14:34Clearance
- 15:17Antenna bias tees
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