robertferanec , 06-06-2016, 12:43 AM
Hi @mairomaster. I read same/similar articles and in past I have seen some components lifted or moved.
However, due density of the boards which we normally do, we do not really have many options to connect the pads of SMD components, so we just do it the way which is possible ... and everything is ok. Maybe the technology is now different, but I have not seen problems cause by connecting pads "not the most recommended way". So, for SMD components, we do not use thermal relief (we use direct connections).