Hi
For 12 layers PCB I have seen below stackup in different places and also at this fedevel link(
https://www.fedevel.com/welldoneblog...clearance-via/ ):
- 12 Layers
- L1 – Signal
- L2 – GND
- L3 – Signal
- L4 – Signal
- L5 – GND
- L6 – Powers
- L7 – Powers
- L8 – GND
- L9 – Signal
- L10 – Signal
- L11 – GND
- L12 – Signal
the question is when we shield 2 adjacent signal layers (e.g. L3, L4) with 2 ground layers (e.g. L2, L5) the 2 internal signal layers will not have crosstalk (or any other EMC interferences) effect from each other when traces on one signal layer is routed in parallel way with another trace on second signal layer? When I checked the IMX6 PCB project I saw you shield all signal layers from each other with GND planes.
If I am going to use above stackup, should I follow a specific point in design (e.g. trace routing way on adjacent signal layers or prepreg or core thickness in stackup or ...)?
and at the end is there any priority for IMX6 stackup over above stackup?
Thanks.