FEDEVEL
Platform forum

Anassoumi , 11-17-2024, 10:09 AM

Hey everyone! Has anyone here specifically used KiCad to route BGA packages like the STM32U599 or nRF5340? Especially curious about your experience with via-in-pad or via hole technology. Would love to hear your thoughts and tips!

Sniper2 , 11-17-2024, 10:48 AM

well it was not a BGA but via in pad was ok , but it was not as fine as your chip

Sniper2 , 11-17-2024, 10:49 AM

if you cap with via i think u should be fine

Anassoumi , 11-17-2024, 11:01 AM

Do you think this i doeable ?

Sniper2 , 11-17-2024, 12:37 PM

yes

Sniper2 , 11-17-2024, 12:37 PM

people did DDR5 in kicad so that MCU is like not even close to the program limit

Sniper2 , 11-17-2024, 12:38 PM

caped via will be like a must for u or be very carefull with fan out

Sniper2 , 11-17-2024, 12:38 PM

u will neeed like 6-10L for that

QDrives , 11-17-2024, 04:19 PM

Which pitch? 0.8, 0.4 or 0.35mm?
For the last two you need HDI and micro vias.

Sniper2 , 11-17-2024, 06:48 PM

0.5

Sniper2 , 11-17-2024, 06:49 PM

@QDrives also i am not sure if OP uses all pins

QDrives , 11-17-2024, 07:36 PM

For the STM32U599 there is BGA 0.8mm, WLCSP 0.4mm or WLCSP 0.35mm - https://www.st.com/en/microcontrollers-microprocessors/stm32u599-5a9.html
For the nF5340 it is either a QFN 0.4mm or WLCSP 0.35mm https://docs.nordicsemi.com/bundle/ps_nrf5340/page/chapters/mec_spec.html
Neither of them have a 0.5mm 'BGA'. 0.5mm pitch might be for the QFP of the STM32.

But seeing his footprint has 216 pins, it is the 0.8mm pitch BGA.

Not using all pads... For the OP I hope so, it makes it easier with 'normal' technology'.