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vajranaga , 05-23-2025, 06:06 PM

Hello, I am trying to use this module: https://www.ti.com/product/TLVM23625
All the available footprints (from ultralibrarian, snapeda, or from samacsys inside OrCAD Capture) have pins instead of vias, which has caused some difficulty in matching the symbol to the footprint, which I have figured out (making dummy pins in the symbol to match the footprint).

I am designing a rather simple 4-layer board (Sig-GND-PWR-Sig), and am trying to get the footprint to behave, but I'm not sure how to fix it. I have DRC errors from the thermal vias (which are designated as pins). The main error is "Thru pin to SMD pin spacing" which is currently in OVERLAP.

Currently on OrCAD PCB Designer Standard 17.4.

I cannot find any resources on how to make such a footprint from scratch, so I'm a little stuck, and I'd rather not change the design or component because of this. I've searched a few youtube vids (nothing with thermal vias on SMD pads), and EMA, parasyseda have similarly simple tutorials that don't really cover such packages (modified QFN).

Any hints, thoughts, resources to get me started or pointed in the right direction?

Thanks!